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Home News Back Thinning Grinding Wheels
Back Thinning Grinding Wheels
Company News
Written by YINGLONG   
Monday, 06 November 2017 19:41

General Information

In Front of the Original Semiconductor Processing, Grinding, Thinning and Polishing of the Wafer Substrate, a Wide Variety of Diamond Grinding stone would be Used for

Back Grinding & Processing the Grinding stone. Based on Various Types of Wafer Materials, like Sapphire Substrate, SiC Substrate, GaAs Substrate, Silicon Substrate,

Different Diamond Grinding stones would be Chosen, such as Diamond Vitrified Grinding stones, Metal Grinding stones, Resin Grinding stones.


In the Process of Machining, “HeroHome” Diamond Grinding stones are with Long Life, Advantageous Grinding and Thinning Result,

Great Extent to Meet the Industry Machining Accuracy and Surface Finish Requirements for Optical Industry and Solve the Weakness of Machining Scratches on the Wafer Surface.


Contact: 0086-13402979928/0086-29-63354775

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Last Updated on Monday, 06 November 2017 19:56

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Export Department

Addr. : No.369, West avenue, Xian, China
Tel:  +86-29-63354776 / 86-29-63354775
Fax: +86-29-63354775 / 83852230 

Technology Dept

Addr.: Modern Industrial Zone, Lintong Dist., Xian, China
Tel: +86-29-63354776 / 86-29-63354775
Fax:+86-29-83852230 / 83852230
Email: Tech